>I am about to start making bonds to my cockpit module and have
>started considering how to clean off mold release compounds and
>dirt/grease before bonding. Would MEK work and not leave a residue?
There should be no mould release on the bonding faces of either cockpit
module or fuselage. In any case you are better using dry abrasive, solvent
just moves contaminants around. Always abrade the two surfaces to be
bonded, except when bonding metals. Chemical etch is best for this.
Boeing specify a test where distilled water is dropped onto the surface, it
should spread out completely. If it doesn't the surface is not clean.
Graham
|